IC Package Modeling Engineer – Thermal (Sr. or Staff Engineer)

Overview

Company:Qualcomm Technologies, Inc.

Job Area:Engineering Group, Engineering Group > ASICS Engineering

Job Overview:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age – and this is where you come in.

GENERAL SUMMARY

QCT RFFE Engineering Team is seeking a talented Thermal Engineer to contribute to continued success of our industry-leading portfolio of RF frond end solutions. The qualified candidate will be part of a larger simulation team contributing to innovative solutions to complex thermal management, mechanical reliability problems in our heterogenous system in package products. Such individual should have in-depth understanding of heat transfer fundamentals in addition to expertise in thermal modeling utilizing CFD/FEA tools. Advanced knowledge of semiconductor device level thermal problems, and system level thermal solution/simulation is required.

Responsibilities:

+ Support thermal/mechanical projects from concept to production phase.

+ Perform thermal simulations utilizing CFD/FEA tools for package and product-level solutions and present results.

+ Design, set up, and execute experiments followed by delivering/presenting results for various thermal or mechanical experiments.

+ Perform thermal simulations to support device level, package level and system-level modeling.

+ Manage technical projects across organization.

+ Conduct test or research on thermal materials and thermal solutions.

+ Research on the industry trend and leading technology in thermal simulation.

Skills/ experiences:

+ 3+ years of semiconductor industry experience in Thermal Engineering/Sciences.

+ Knowledge of Radio Frequency (RF) Fundamentals

+ Thorough understanding of cooling techniques for electronic components and equipment.

+ In-depth understanding of natural and forced convection cooling relating to consumer electronics.

+ Good knowledge of semiconductor device physics and thermal issues.

+ Through understanding of JEDEC/IPC thermal related standards/specifications.

+ Design experience with PCB, component placement, enclosures, and heat sinks.

+ Expertise in conducting CFD simulations utilizing tools such as ANSYS-Icepak or Flotherm.

+ Experience with design based simulation.

+ Ability to design thermal tests and execute per plan within a laboratory environment.

+ Some experience with CAD tools such as Solidworks, AutoCAD

+ Experience operating thermal measurement equipment such as IR camera, thermal couple, etc.

+ Excellent communication skills.

Physical Requirements

+ Frequently transports between offices, buildings, and campuses up to ½ mile.

+ Frequently transports and installs equipment up to 5 lbs.

+ Performs required tasks at various heights (e.g., standing or sitting).

+ Monitors and utilizes computers and test equipment for more than 6 hours a day.

+ Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.

Minimum Qualifications

Education:

Bachelors – Engineering, Bachelors – Science

Work Experiences:

2+ years ASIC design, verification, or related work experience.

Certifications:

Skills:

Preferred Qualifications

Education:

Doctorate – Applied Physics, Doctorate – Electrical Engineering, Doctorate – Mechanical Engineering, Masters – Applied Physics, Masters – Electrical Engineering, Masters – Mechanical Engineering

Work Experiences:

Certifications:

Skills:

ANSYS Icepak, ANSYS Mechanical, Flotherm, Semiconductor Physics, Thermal Testing

Applicants: If you are an individual with a disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hr_public_article_view&sysparm_article=KB0039028) for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. Qualcomm is an equal opportunity employer and supports workforce diversity.

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .

We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—we invent breakthrough technologies that transform how the world connects, computes, and communicates.

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